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 OKI Semiconductor MK70215
Bluetooth Module
PEDL70215-01
Issue Date: Jul. 30, 2003
Preliminary
GENERAL DESCRIPTION The MK70215 is Bluetooth module operates in the 2.4 GHz ISM band. Embedded baseband /RF transceiver LSI and protocol stacks up to Serial Port Profile(SPP) provide users with Bluetooth Class2 stable wireless connectivity and high performance. Equipped with UART/PCM interface, it is suitable for both data/voice application purposes. This surface-mount type module can be mounted to users' boards easily by soldering. The development TAT for Bluetooth-enabled end products can be shortened very effectively by utilizing MK70215.
FEATURES Conforms to the Bluetooth Specification Version 1.1 Optimized design where RF/BB LSI chips and authorized OKI software are used SPP full module includes Bluetooth baseband IC & RF transceiver IC, EEPROM and XTAL RF output power: Class 2 Interfaces provided UART interface (Supports HCI and SPP commands /up to 921.6 kbps) PCM interface* (selectable between PCM Linear/A-law/-law) * The PCM I/F is only valid in the HCI mode.
BLUETOOTH is a trademark owned by Bluetooth SIG, Inc. and licensed to Oki Electric Industry. The information contained herein can change without notice owing to the product being under development.
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BLOCK DIAGRAM
GND Baseband-LSI
EEPROM ARM7TDMI
VDD nReset nDetach PCM_IN
T/R SW
RF-LSI
BaseBand Core
PCM I/F
PCM_OUT PCM_SYNC PCM_CLK
BPF
UART_TD RF_ANT
ROM UART I/F
UART_RD UART_RTS UART_CTS
Osc 13MHz
Osc 32.768kHz
RAM GPIO I/F
CIO2 CIO3 CIO4 CIO5 CIO6
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ABSOLUTE MAXIMUM RATINGS
Parameter Power supply voltage Input voltage Input RF power Storage temperature Symbol VDD VIN -- Tstg Condition Ta = 25C Ta = 25C Ta = 25C -- Rating -0.3 to 4.5 -0.3 to 4.5 20 -40 to +85 Unit V V dBm C
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RECOMMENDED OPERATING CONDITIONS
Parameter Power supply voltage "H" level input voltage "L" level input voltage Operating temperature Symbol VDD Vih Vil TOP Condition -- -- -- -- Min. 3.0 2.2 0 -30 Typ. 3.3 -- -- 25 Max. 3.6 VDD 0.8 75 Unit V V V C
ELECTRICAL CHARACTERISTICS
Following values are valid for VDD = 3.3 V 0.3 V, Ta = -30 to 75C. Values of the RF characteristics are defined at the RF_ANT pin for the module. General Specifications
Items Conformance Specifications Power Class Frequency range Number of channels Channel separation Modulation method RF input-output impedance Symbol Rate Specification Bluetooth Specification Version 1.1 Class 2 2,402 to 2,480 MHz 79ch 1 MHz GFSK Nominal 50 1 Mbps Note -- -- -- -- -- -- 2,402 to 2,480 MHz --
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DC Characteristics Output voltage (Applies to digital pins )
Parameter "H" level output voltage "L" level output voltage Symbol Voh Vol Min. 2.4 -- Typ. -- -- Max. -- 0.4 Unit V V
Power consumption
Mode During operation During stand-by Symbol IDDO IDDS Typ. 80 200 Max. -- -- Unit mA A
RF Transmission Characteristics
Parameter Output power ICFT Frequency drift DH1 DH3, DH5 Frequency Max drift rate -25 -40 +25 +40 20 kHz kHz kHz/50 s Min. -4 -50 Max. +4 +50 Unit dBm kHz Remarks
Frequency deviation f1avg: payload = 11110000 f2max: payload = 1010... f2avg/f1avg 20 dB band width In-band spurious emission Freq. offset = 2 MHz Freq. offset 3 MHz Out-of-band spurious emission 30 MHz f < 1GHz 1 GHz f 12.75 GHz 1.8 GHz f 1.9 GHz 5.15 GHz f 5.30 GHz 30 MHz f < 1GHz 1 GHz f 12.75 GHz 1.8 GHz f 1.9 GHz 5.15 GHz f 5.30 GHz -- -- -- -- -- -- -- -- -36 -30 -47 -47 -57 -47 -47 -47 dBm dBm dBm dBm When in standby dBm dBm dBm dBm -- -- -20 -40 dBm dBm When operating 140 115 80 -- 175 -- -- 1 kHz kHz % MHz Measured by peak detection
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RF Reception Characteristics
Parameter Sensitivity*1 C/I characteristics Co-channel Adjacent channel C/I = 1 MHz Adjacent channel C/I = 2 MHz Adjacent channel C/I 3 MHz Image frequency Image frequency 1 MHz Out-of-band blocking 30 MHz f < 2,000 MHz 2,000 MHz f 2,399 MHz 2,498 MHz f < 3,000 MHz 3,000 MHz f 12.75 GHz Intermodulation characteristic Maximum input level Limit of collateral radio waves 30 MHz f < 1 GHz 1 GHz f 12.75 GHz -- -- -57 -47 dBm dBm -10 -27 -27 -10 -25 -- -- -- -- -- -- -- -- -- -- -- 0.1 dBm dBm dBm dBm dB % Specification at ordinary temperature Specification at ordinary temperature, at -20 dBm input Spurious emission during inquiry scan operation -- -- -- -- -- -- 12 14 4 -30 -40 -9 -20 dB dB dB dB dB dB Specification at ordinary temperature Min. -- Typ. -77 Max. -72 Unit dBm Specification at ordinary temperature (Bluetooth Ver.1.1 Test Specification) Remarks
*1 The receiver sensitivity is measured at BER 0.1% by Dirty transmitter Signal (According to Bluetooth Ver.1.1 Test Specification ) Others Characteristics Conducted Emission and Radiation Emission level : Satisfied with FCC, TELEC, ETSI specification.
MECHANICAL CHARACTERISTICS
Marking Specifications Company name : OKI (Refer to Module Outline) Model name:MK70215 (Refer to Module Outline) Lot. No:XXXXXXX\ (Refer to Module Outline) 1 pin mark (Refer to Module Outline) Weight Specifications
Model Name MK70215 Weight 1.5 g (Max.)
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CONNECTOR PIN DESCRIPTIONS MK70215 INSIDE PULL UP/DOWN
-- --
TERMINAL NAME I/O TYPE RF_ANT (*1) UART_TD UART_RD UART_RTS UART_CTS PCM_IN (*2) PCM_OUT PCM_SYNC (*3) PCM_CLK (*3) nRESET(*4) nDetach CIO2 CIO3 CIO4 CIO5 CIO6 Vdd (*5) GND AGND I/O O I O I I O I/O I/O I I I O O I I
- - -
FUNCTION Z0=50 UART Data Output UART Data Input UART Ready to Send UART Clear to Send Synchronous 8kss-1 Data Input Synchronous 8kss-1 Data Output Synchronous Data Strobe Synchronous Data Clock Active low reset (L:Reset) Active low sleep signal (L:Sleep)
-- -- -- -- --
Schmitt
-- --
Pull up
--
Pull down Pull down Pull up Pull up Pull up
-- --
Pull up Pull up
-- -- --
Power Supply Voltage
-- --
*1 Terminated to a 50 load or connected to ANT. *2 The PCM_IN pins are pulled-up internally. *3 The PCM_CLK, and PCM_SYNC pins are pulled-down internally. *4 Setting the reset signal input pin RESET to a "L" level can reset the LSI. The reset state of the LSI is held for a duration of 10 msec even after the reset signal is switched to a "H" level. *5 Mount an approximately 10F tantalum or electrolytic capacitor to the power supply input pin. The capacitor should be mounted as close to the power supply pin of the module as possible. * The PCM I/F is only valid in the HCI mode.
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INTERFACE SPECIFICATIONS
UART Interface Various settings can be made for the UART interface by using the Vendor specific command (refer to the ML70512 Software Manual). The default values are as follows: * Baud rate: 115.2 kbps * Parity: Non-parity * Data length: 8 bits * Stop bit: 1 bit * Flow control: off
PCM Interface * Application format PCM linear (8, 16 bits/sample, 64 kHz sampling frequency)/A-law/-law * Bluetooth format CVSD/A-law/-law
8 bits or 16 bits
PCMCLK (64kHz or 128kHz) LSB PCMOUT Data is output at the timing of CLK rise. PCMSYNC MSB DATA DATA DATA LSB MSB DATA
125 s (8 kHz)
PCM Output Timing
8 bits or 16 bits
PCMCLK (64kHz or 128kHz) LSB PCMIN Data is captured at the timing of CLK fall. PCMSYNC MSB DATA DATA DATA LSB MSB DATA
125 s (8 kHz)
PCM Input Timing
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PCM Timing Specifications
Parameter PCMIN setup time to PCMCLK (input) fall PCMIN hold time to PCMCLK (input) fall PCMOUT setup time to PCMCLK (input) rise PCMOUT hold time to PCMCLK (input) rise PCMSYNC (input) setup time to PCMCLK (input) rise PCMSYNC (input) hold time to PCMCLK (input) rise PCMIN setup time to PCMCLK (output) fall PCMIN hold time to PCMCLK (output) fall PCMOUT setup time to PCMCLK (output) rise PCMOUT hold time to PCMCLK (output) rise Delay time from PCMCLK (output) rise to PCMSYNC (output) Symbol tPC0 tPC1 tPC2 tPC3 tPC4 tPC5 tPC7 tPC8 tPC9 tPC10 tPC13 CL = 50 pF Condition Min. 500 500 500 500 500 500 500 500 500 500 Typ. Max. 500 ns Unit
PCMCLK (input) PCMIN
tPC0
PCMOUT
tPC1
tPC2
PCMSYNC (input)
tPC3
tPC2
tPC3
tPC4
PCMSYNC (output)
tPC5 tPC6
tPC4
tPC5
PCMCLK (output) PCMIN
tPC7
PCMOUT
tPC8 tPC9 tPC11 tPC10 tPC12
tPC9
PCMSYNC (input)
tPC10 tPC12 tPC13
tPC11
PCMSYNC (output)
PCM Timing
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MOUNTING MODULE
Recommended Module Fixing Method * This module corresponds to Reflow-soldering. * This module corresponds to Pb-free
Recommended Reflow Conditions
Recommended PCB Pattern
The accuracy of each size is 0.05mm.
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Notes on Mounting the Module 1. The shielding case is connected to GND in the module. For mounting the module, when pattern wiring that touches the shielding case is carried out on the product board, do not cause a short-circuit between the shielding case and the pattern. For example, apply resist on the entire surface that touches the shielding case. 2. The effects of noise on a product board depend on the connection of GND/NC to the fixation pads. Select the connection with better electrical characteristics in the module mounted state.
CAUTIONS IN USE
This module consists of precision electronic components. Therefore, note the following when handling the module: 1. In a case of decomposition or recomposition of this module, the operations in these specifications are not assured. 2. This module is not waterproof or drip-proof. Do not use the module in wet locations. 3. Do not use this module under high temperature or high humidity conditions, in direct sunlight, or in dusty places.
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MODULE OUTLINE
Outline of MK70215
OKI
MK70215
1 6 .7 0 .1 m m 1 7 .5 0 .1 2 7 m m
Lot. No,
1 .7 m m 2 .2 0 .1 m m 0 . 8 0 . 0 5 m m x 2 0 p ls 1 7 .0 0 .1 2 7 m m
1 6 .2 0 .1 2 7 m m
0 .2 0 .0 8 m m
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REVISION HISTORY
Document No. PEDL70215-01 Page Date July 30,2003 Previous Edition -- -- Current Edition -- -- Description Preliminary edition 1
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NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. Neither indemnity against nor license of a third party's industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party's right which may result from the use thereof. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not, unless specifically authorized by Oki, authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. No part of the contents contained herein may be reprinted or reproduced without our prior permission. Copyright 2003 Oki Electric Industry Co., Ltd.
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